Thin, Fast, and Powerful: MIT’s “Stacked” 3D Chips Shatter Industry Constraints

High Rise 3D ChipsAn electronic stacking technique has the potential to exponentially boost the number of transistors on chips, paving the way for more efficient AI hardware. The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up […]

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