The chip and cooling system for Samsung’s Galaxy S25 Ultra has reportedly leaked online.

According to leaker Ahmed Qwaider on Twitter/X, the S25 is rumoured to get the Qualcomm Snapdragon 8 Elite alongside a larger vapour chamber, which would improve cooling by 10 percent.

Other rumours corroborate this, suggesting that the S25 Ultra is expected to get the Snapdragon 8 Elite chip worldwide, instead of using Samsung’s in-house Exynos chips. (In the past, Samsung flagships in Canada usually had a Qualcomm chip while other markets got the Exynos version.)

The new cooling system will distribute the heat throughout the device, which should improve performance and reduce how much heat users feel. This was done in the Samsung Galaxy S24, so the larger vapour chamber should offer improvements over the previous system.

⭕️Exclusive
Amazing performance🔥@Snapdragon 8 Elite
in Galaxy S25 Ultra

GPU. 34%
CPU. 38%
NPU. 43%

Vaper Chamber:
The cooling rate will be higher
Galaxy S25 Ultra 42%🔥
S25/S25+ 10%

The heat will be distributed throughout the device so that you do not feel any heat😉 pic.twitter.com/PGe6MADJP9

— Ahmed Qwaider (@AhmedQwaider888) January 8, 2025

TSMC manufactures the Qualcomm Snapdragon 8 Elite using the N3 manufacturing process. The Snapdragon 8 Elite is expected to provide more power for the S25 Ultra, especially when under load for gaming or anything revolving around AI.

According to Qualcomm, the chip is designed with AI in mind. It boasts the Qualcomm AI Engine alongside the Adreno GPU, Oryon CPU, and the Qualcomm Hexagon NPU. Qualcomm claims that the AI engine improves AI performance by 45% and boosts performance per watt by 45%.

Samsung has scheduled a Galaxy Unpacked event for January 22nd, and the Galaxy S25 Ultra could be debuted at the event, potentially alongside the AI Subscription Club. As the event is only 13 days away, more leaks surrounding the device are popping up.

Source: Ahmed Qwaider Via: Android Police